Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics

Shangxi WANG, Dan ZHANG, Gaoshan LIU, Wenjun WANG, Mengxia HU


Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire method and the laser-flash method. Usually, the thermal conductivities of porcelain is low and meet the measurement range of hot-wire method, and the measured value by hot-wire method has little difference with that by laser-flash method. In recent years, with the requirement of high-powered LED lighting, some kinds of ceramic substrates with good thermal conductivity have been developed and their thermal conductivity always measured by the means of laser flash method, which needs expensive instrument. In this paper, in order to detect the thermal conductivity of fine ceramic with convenience and low cost, the feasibility of replacing the laser flash method with hot wire method to measure thermal conductivity of ceramic composites was studied. The experiment results showed that the thermal conductivity value of fine ceramics measured by the hot-wire method is severely lower than that by the laser-flash method. However, there is a positive relationship between them. It is possible to measure the thermal conductivity of fine ceramic workpiece instantly by hot-wire method via a correction formula.



thermal conductivity, hot-wire method, laser-flash method, ceramic substrate

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Print ISSN: 1392–1320
Online ISSN: 2029–7289