EQCM Study of Influence of Anion Nature on Electrochemical Reduction of Bismuth Sulfide in Nickel Plating Solution

  • Loreta TAMAŠAUSKAITĖ-TAMAŠIŪNAITĖ Center for Physical Sciences and Technology
  • Leonas NARUŠKEVIČIUS Center for Physical Sciences and Technology
  • Albina ŽIELIENĖ Center for Physical Sciences and Technology
  • Birutė ŠIMKŪNAITĖ-STANYNIENĖ Center for Physical Sciences and Technology
  • Genovaitė VALIULIENĖ Center for Physical Sciences and Technology
  • Aloyzas SUDAVIČIUS Center for Physical Sciences and Technology
Keywords: bismuth sulfide, nickel, SILAR, EQCM, XPS

Abstract

The influence of anion nature on the reduction of bismuth sulfide film deposited on gold using the successive ionic layer adsorption and reaction method in solutions containing Ni2+ ions has been investigated by electrochemical quartz crystal microbalance combined with cyclic voltammetry and X-ray photoelectron spectroscopy. It has been determined that the reduction of bismuth sulfide film in the nickel plating solution depends on the anion nature: larger cathodic current and mass changes (Dƒ) are observed in the solution containing acetate anion as compared to those in the solution containing sulfate anion. As the reduction of bismuth sulfide film in the background solutions depends on the nature of anion, it influences the cathodic reduction of Ni2+ ions prior to OPD of Ni. A greater current and mass change (Dƒ) is conditioned by simultaneously occurring reduction of bismuth sulfide film when the film is reduced in the acetate nickel plating electrolyte in contrast to that in the sulfate one.

http://dx.doi.org/10.5755/j01.ms.17.1.244

Section
METALS, ALLOYS, COATINGS