Reinforcement of Conducting Silver-based Materials

  • Heike JUNG Technische Universität Chemnitz (Chemnitz University of Technology)
  • Daisy NESTLER Technische Universität Chemnitz (Chemnitz University of Technology)
  • Bernhard WIELAGE Technische Universität Chemnitz (Chemnitz University of Technology)
  • Thomas LAMPKE Technische Universität Chemnitz (Chemnitz University of Technology)
Keywords: mechanical alloying, silver/tungsten composite powder, microstructure, particle-reinforced, conducting materials

Abstract

Silver is a well-known material in the field of contact materials because of its high electrical and thermal conductivity. However, due to its bad mechanical and switching properties, silver alloys or reinforcements of the ductile silver matrix are required. Different reinforcements, e. g. tungsten, tungsten carbide, nickel, cadmium oxide or tin oxide, are used in different sectors of switches. To reach an optimal distribution of these reinforcements, various manufacturing techniques (e. g. powder blending, preform infiltration, wet-chemical methods, internal oxidation) are being used for the production of these contact materials. Each of these manufacturing routes offers different advantages and disadvantages. The mechanical alloying process displays a successful and efficient method to produce particle-reinforced metal-matrix composite powders. This contribution presents the obtained fine disperse microstructure of tungsten-particle-reinforced silver composite powders produced by the mechanical alloying process and displays this technique as possible route to provide feedstock powders for subsequent consolidation processes.

DOI: http://dx.doi.org/10.5755/j01.ms.20.3.4889

Author Biographies

Heike JUNG, Technische Universität Chemnitz (Chemnitz University of Technology)

Fakultät für Maschinenbau

Institut für WErkstoffwissenschaft und Werkstofftechnik

(Faculty of Mechanical Engineering,
Institute of Materials Science and Engineering)

Daisy NESTLER, Technische Universität Chemnitz (Chemnitz University of Technology)

Fakultät für Maschinenbau

Institut für WErkstoffwissenschaft und Werkstofftechnik

(Faculty of Mechanical Engineering,
Institute of Materials Science and Engineering)

Bernhard WIELAGE, Technische Universität Chemnitz (Chemnitz University of Technology)

Fakultät für Maschinenbau

Institut für WErkstoffwissenschaft und Werkstofftechnik

(Faculty of Mechanical Engineering,
Institute of Materials Science and Engineering)

Thomas LAMPKE, Technische Universität Chemnitz (Chemnitz University of Technology)

Fakultät für Maschinenbau

Institut für WErkstoffwissenschaft und Werkstofftechnik

(Faculty of Mechanical Engineering,
Institute of Materials Science and Engineering)

Published
2014-09-16
Section
ELECTRONIC AND OPTICAL MATERIALS