Surface Properties After Wet Release of Microcantilever
Keywords:surface micromachining technology, microcantilever, wet release
Electrostatically actuated nickel microcantilever was fabricated by surface micromachining technology, using Ni (structural) and Cu (sacrificial) layers. Physical reasons influencing performance and sticking problem were analysed. Slightly increased silicon substrate surface roughness was determined by AFM for the samples after wet release. X-ray photoelectron spectra of typical samples show, that differences of surface adhesion between the samples after O2 plasma treatment and after removal of Cu film and drying decreases and correlate with the copper residues and growth of the natural SiO2 film.
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