Surface Properties After Wet Release of Microcantilever

Authors

  • Viktoras GRIGALIŪNAS∗, Sigita PONELYTĖ, Karolis MALINAUSKAS, Asta GUOBIENĖ, Mindaugas ANDRULEVIČIUS, Angelė GUDONYTĖ Kaunas University of Technology

Keywords:

surface micromachining technology, microcantilever, wet release

Abstract

Electrostatically actuated nickel microcantilever was fabricated by surface micromachining technology, using Ni (structural) and Cu (sacrificial) layers. Physical reasons influencing performance and sticking problem were analysed. Slightly increased silicon substrate surface roughness was determined by AFM for the samples after wet release. X-ray photoelectron spectra of typical samples show, that differences of surface adhesion between the samples after O2 plasma treatment and after removal of Cu film and drying decreases and correlate with the copper residues and growth of the natural SiO2 film.

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Published

2008-06-12

Issue

Vol. 14 No. 2 (2008)

Section

ELECTRONIC AND OPTICAL MATERIALS

License

 

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