Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate

Authors

  • Zhigang LI Hefei University of Technology
  • Yigang HE Hefei University of Technology
  • Hao ZHAO China Electronic Product Reliability and Environmental Testing Research Institute
  • Jianyu WU China Electronic Product Reliability and Environmental Testing Research Institute
  • Zhenbo ZHAO China Electronic Product Reliability and Environmental Testing Research Institute

DOI:

https://doi.org/10.5755/j02.ms.34711

Keywords:

insulated metal substrate, hexagonal boron nitride, epoxy resin, thermal conductivity, peel strength

Abstract

In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixture containing h-BN nanosheets, micron particles, and nanoparticles. TCA was synthesized by dispersing a 40 % BN mixture modified by γ-aminopropyltriethoxysilane (KH550) into epoxy resin. The TCA has a relatively high thermal conductivity of 4.48 W·m-1·K-1 and a breakdown strength of 15.32 kV·mm-1. As the TCA film was coated on the matte side of the copper plate, the peel strength can reach 1.63 N·mm-1, indicating excellent practicality in the field of electronic packaging.

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Published

2024-05-15

Issue

Section

POLYMERS AND COMPOSITES