Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate

Abstract

In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixture containing h-BN nanosheets, micron particles, and nanoparticles. TCA was synthesized by dispersing a 40 % BN mixture modified by γ-aminopropyltriethoxysilane (KH550) into epoxy resin. The TCA has a relatively high thermal conductivity of 4.48 W·m^-1·K^-1 and a breakdown strength of 15.32 kV·mm^-1. As the TCA film was coated on the matte side of the copper plate, the peel strength can reach 1.63 N·mm^-1, indicating excellent practicality in the field of electronic packaging.