Optimizing the Thickness Uniformity of Magnetron Sputtering Deposited Films on a Large-Scale Curved Workpiece Surface

Authors

  • Zhao JIANG Lanzhou Institute of Physics
  • Zhenlin WANG Lanzhou Institute of Physics
  • Shuilian LUO Lanzhou Institute of Physics
  • Zhanji MA Lanzhou Institute of Physics
  • Yanchun HE Lanzhou Institute of Physics
  • Jiang XU Lanzhou Institute of Physics

DOI:

https://doi.org/10.5755/j02.ms.35103

Keywords:

film thickness uniformity, magnetron sputtering, large-scale curved workpiece, simulated calculation

Abstract

This study prepared magnetron-sputtering deposition film on a large-scale curved workpiece with a favorable thickness uniformity using a rectangular target cathode. For a substrate rotation structure with eccentric rotation/revolution composite motion, the geometrical model of the thickness distribution of the coating film on a large substrate was established in combination with the principle of rectangular cathode magnetron sputtering. The integral formula of the film thickness was derived, and various film thickness distribution patterns under different parameters were simulated. According to the present research results, the film thickness distribution can be optimized by adjusting the revolution-to-rotation radius and eccentric ratios. At an eccentric distance of 400 mm and a radius ratio of 2.78, the most favorable uniformity degree of 0.87 was obtained, which was controlled by the motion path of the fixed point on the substrate. The proposed approach helps to obtain large-scale films with favorable uniformity on the substrate.

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Published

2024-01-30

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Section

Articles