Elaboration of Thin Foils in Copper and Zinc by Self-Induced Ion Plating

Abstract

The aim of this work was to determine the ability to produce thin metallic foils by self-induced ion plating. Foils of pure copper and pure zinc with a thickness of 35 µm have been successfully produced and their characteristics have been compared to foils obtained by conventional techniques (i. e. electroplating and rolling). Results show the following: (i) more or less compact microstructures can be obtained by self-induced ion plating depending on gas pressure and substrate temperature; (ii) microstructures obtained by self-induced ion plating are quite different from those obtained by electroplating and rolling; (iii) Young’s modulus depends on foils roughness; (iv) hardness depends on grain size by exhibiting a Hall-Petch behavior in the case of copper foils and an “inverse” Hall-Petch behavior in the case of zinc foils.

DOI: http://dx.doi.org/10.5755/j01.ms.20.2.4019