Phase Evolution and Cu Partitioning of Amorphous Ti30Cu70 Ribbons in Liquid Sn at 590 ℃

Abstract

Elemental redistribution is able to achieve through thermal diffusion and formation of intermetallic phases in amorphous Ti₃₀Cu₇₀ ribbons in liquid Sn at 590 ℃. Cu elements are replaced partially by Sn elements gradually with the extension of treatment time, and most of Cu elements can be replaced by Sn at 60 s. Preformed Ti₂Cu intermetallic phases in amorphous Ti₃₀Cu₇₀ ribbons still remain as preformed due to their higher thermal stability than Sn-containing intermetallics. Both Ti₆Sn₅ and Ti₂Sn₃ intermetallic phases are preferred to form after thermal diffusion for 60 s. The repartitioning rate of Sn elements is confirmed to be 5.61 × 10^-8 m s^-1 according to the change of the thickness of residual layers with high Cu concentration. The present methodology provides a possible alloying way to fabricate the precursors with multilayers where different intermetallic phases.